CVD Diamond Wire Drawing Dies 3x Longer Life for Tungsten / Gold Wire Production

CVD Diamond Wire Drawing Dies - (111) Crystal Orientation
The Ultimate Solution for Precision Wire Manufacturing

Dimensional parameters

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Key Specifications

1.Exceptional Mechanical Properties

· Young's Modulus: 1150-1300 GPa

· Microhardness: 80-150 GPa

· Adjustable Nitrogen Content: 30-200 ppm

2.Flawless Monocrystalline Structure

· Inclusion/Dislocation Free

· Wear Rate Variation <5%

· Custom Solutions: Lattice Engineering for Hard/Soft Wires

3.Unrivaled Durability

· Fracture Strength >8 GPa (3-Point Bending Test)

· 5,000km Crack-Free Operation (φ0.03mm Cu Wire)

· 92% Lower Cracking Rate vs PCD Dies

4.Atomic-Level Precision

· (111) Orientation Accuracy <0.5° (XRD Aligned)

· Bore Tolerance: ±0.05mm

· Surface Roughness Ra <0.1μm

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Competitive Advantages of (111)-Oriented CVD Diamond

1.Crystal Orientation Engineering: (111) plane maximizes shear strength along <110> wire drawing direction, 3x more wear-resistant than PCD

2.Defect-Free Reliability: Monocrystalline structure eliminates intergranular fracture risks in polycrystalline materials

3.Intelligent Thermal Management: 2000 W/m·K thermal conductivity prevents localized overheating

4.Nano-Scale Precision: Laser-machined bore surface (Ra<0.1μm) reduces wire surface scratches by 95%

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Technical Superiority

· Smart Matching System: Auto-recommends nitrogen gradient by wire hardness

· Thermal Stability: <0.002% Deformation at 1200℃

· Modular Design: Quick-change structure minimizes downtime

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Applications

1.Ultra-Fine Refractory Wires

2.Stainless Steel Wire

3.Precious Metal Processing

4.High-Performance Alloys

5.Semiconductor Bonding Wires

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Product Pictures